• Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: SIMILAR TO TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    566 bytes (70 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: SIMILAR TO TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    566 bytes (70 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: SIMILAR TO TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    566 bytes (70 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: HERMETIC SEALED PACKAGE-4; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Application: AMPLIFIER; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    598 bytes (72 words) - 01:15, 28 October 2021
  • @V(DS) (V) (Test Condition): 15; Absolute Max. Power Diss. (W): 300m; C(iss) Max. (F): 6.0p; I(DSS) Min. (A): 10m; I(GSS) Max. (A): 100p; Military: N; Package: Chip; V(BR)DSS (V): 50; V(BR)GSS (V): 50; V(GS)off Max. (V): 6.0; g(fs) Max, (S) Trans. conduct,: 6.5m; g(fs) Min. (S) Trans. conduct.: 3.0m
    300 bytes (57 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; Drain Current-Max (ID): 0.0100 A; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Number of Elements: 1; Number of Terminals: 3; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Application: AMPLIFIER; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    562 bytes (67 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Mfr Package Description: TO-72, CASE 20-03, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Status: ACTIVE; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Application: AMPLIFIER; Transistor Element Material: SILICON; Transistor Type: GENERAL PURPOSE SMALL SIGNAL
    524 bytes (63 words) - 01:15, 28 October 2021
  • @V(DS) (V) (Test Condition): 15; Absolute Max. Power Diss. (W): 300m; C(iss) Max. (F): 6.0p; I(DSS) Min. (A): 10m; I(GSS) Max. (A): 100p; Mil Number: JAN2N3822; Military: Y; Package: TO-72; V(BR)DSS (V): 50; V(BR)GSS (V): 50; V(GS)off Max. (V): 6.0; g(fs) Max, (S) Trans. conduct,: 6.5m; g(fs) Min. (S) Trans. conduct.: 3.0m
    324 bytes (61 words) - 01:15, 28 October 2021
  • @V(DS) (V) (Test Condition): 15; Absolute Max. Power Diss. (W): 300m; C(iss) Max. (F): 6.0p; I(DSS) Min. (A): 10m; I(GSS) Max. (A): 100p; Mil Number: JANS2N3822; Military: Y; Package: TO-72; V(BR)DSS (V): 50; V(BR)GSS (V): 50; V(GS)off Max. (V): 6.0; g(fs) Max, (S) Trans. conduct,: 6.5m; g(fs) Min. (S) Trans. conduct.: 3.0m
    325 bytes (61 words) - 01:15, 28 October 2021
  • @V(DS) (V) (Test Condition): 15; Absolute Max. Power Diss. (W): 300m; C(iss) Max. (F): 6.0p; I(DSS) Min. (A): 10m; I(GSS) Max. (A): 100p; Mil Number: JANTX2N3822; Military: Y; Package: TO-72; V(BR)DSS (V): 50; V(BR)GSS (V): 50; V(GS)off Max. (V): 6.0; g(fs) Max, (S) Trans. conduct,: 6.5m; g(fs) Min. (S) Trans. conduct.: 3.0m
    326 bytes (61 words) - 01:15, 28 October 2021
  • @V(DS) (V) (Test Condition): 15; Absolute Max. Power Diss. (W): 300m; C(iss) Max. (F): 6.0p; I(DSS) Min. (A): 10m; I(GSS) Max. (A): 100p; Mil Number: JANTXV2N3822; Military: Y; Package: TO-72; V(BR)DSS (V): 50; V(BR)GSS (V): 50; V(GS)off Max. (V): 6.0; g(fs) Max, (S) Trans. conduct,: 6.5m; g(fs) Min. (S) Trans. conduct.: 3.0m
    327 bytes (61 words) - 01:15, 28 October 2021
  • Analog IC - Other Type: POWER SUPPLY SUPPORT CKT; China RoHS Compliant: Yes; EU RoHS Compliant: Yes; Lead Free: Yes; Mfr Package Description: EIAJ, SC-74A, SOT-23A, 5 PIN; Number of Channels: 2; Number of Functions: 1; Number of Terminals: 5; Operating Temperature-Max: 85 Cel; Operating Temperature-Min: -40 Cel; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR; Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH; Status: ACTIVE; Supply Voltage-Max (Vsup): 10 V; Supply Voltage-Min (Vsup): 1.5 V; Supply Voltage-Nom (Vsup): 2 V; Surface Mount: Yes; Temperature Grade: INDUSTRIAL; Terminal Finish: MATTE TIN; Terminal Form: GULL WING; Terminal Pitch: 0.9500 mm; Terminal Position: DUAL
    707 bytes (95 words) - 01:15, 28 October 2021
  • Analog IC - Other Type: POWER SUPPLY SUPPORT CKT; China RoHS Compliant: Yes; EU RoHS Compliant: Yes; Lead Free: Yes; Mfr Package Description: EIAJ, SC-74A, SOT-23A, 5 PIN; Number of Channels: 2; Number of Functions: 1; Number of Terminals: 5; Operating Temperature-Max: 85 Cel; Operating Temperature-Min: -40 Cel; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR; Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH; Status: ACTIVE; Supply Voltage-Max (Vsup): 10 V; Supply Voltage-Min (Vsup): 1.5 V; Supply Voltage-Nom (Vsup): 2 V; Surface Mount: Yes; Temperature Grade: INDUSTRIAL; Terminal Finish: MATTE TIN; Terminal Form: GULL WING; Terminal Pitch: 0.9500 mm; Terminal Position: DUAL
    707 bytes (95 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    582 bytes (72 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Mfr Package Description: CERAMIC PACKAGE-3; Number of Elements: 1; Number of Terminals: 3; Operating Mode: DEPLETION; Package Body Material: CERAMIC, METAL-SEALED COFIRED; Package Shape: RECTANGULAR; Package Style: SMALL OUTLINE; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Surface Mount: Yes; Terminal Form: NO LEAD; Terminal Position: DUAL; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    563 bytes (68 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: SIMILAR TO TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    593 bytes (74 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    582 bytes (72 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: METAL-OXIDE SEMICONDUCTOR; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    599 bytes (73 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    582 bytes (72 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Mfr Package Description: CERAMIC PACKAGE-3; Number of Elements: 1; Number of Terminals: 3; Operating Mode: DEPLETION; Package Body Material: CERAMIC, METAL-SEALED COFIRED; Package Shape: RECTANGULAR; Package Style: SMALL OUTLINE; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Surface Mount: Yes; Terminal Form: NO LEAD; Terminal Position: DUAL; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    563 bytes (68 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    582 bytes (72 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Mfr Package Description: CERAMIC PACKAGE-3; Number of Elements: 1; Number of Terminals: 3; Operating Mode: DEPLETION; Package Body Material: CERAMIC, METAL-SEALED COFIRED; Package Shape: RECTANGULAR; Package Style: SMALL OUTLINE; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Surface Mount: Yes; Terminal Form: NO LEAD; Terminal Position: DUAL; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    563 bytes (68 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Highest Frequency Band: VERY HIGH FREQUENCY BAND; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Terminal Finish: TIN LEAD; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    582 bytes (72 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; DS Breakdown Voltage-Min: 50 V; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Mfr Package Description: CERAMIC PACKAGE-3; Number of Elements: 1; Number of Terminals: 3; Operating Mode: DEPLETION; Package Body Material: CERAMIC, METAL-SEALED COFIRED; Package Shape: RECTANGULAR; Package Style: SMALL OUTLINE; Power Dissipation Ambient-Max: 0.3000 W; Status: ACTIVE; Surface Mount: Yes; Terminal Form: NO LEAD; Terminal Position: DUAL; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    563 bytes (68 words) - 01:15, 28 October 2021
  • Channel Type: N-CHANNEL; Configuration: SINGLE; FET Technology: JUNCTION; Feedback Cap-Max (Crss): 3 pF; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Operating Mode: DEPLETION; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Status: ACTIVE; Terminal Finish: NOT SPECIFIED; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: RF SMALL SIGNAL
    464 bytes (57 words) - 01:15, 28 October 2021
  • Configuration: SINGLE; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Status: ACTIVE; Terminal Finish: NOT SPECIFIED; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: GENERAL PURPOSE SMALL SIGNAL
    368 bytes (45 words) - 01:15, 28 October 2021
  • Configuration: SINGLE; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Status: ACTIVE; Terminal Finish: NOT SPECIFIED; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: GENERAL PURPOSE SMALL SIGNAL
    368 bytes (45 words) - 01:15, 28 October 2021
  • Configuration: SINGLE; Mfr Package Description: TO-72, 4 PIN; Number of Elements: 1; Number of Terminals: 4; Package Body Material: METAL; Package Shape: ROUND; Package Style: CYLINDRICAL; Status: ACTIVE; Terminal Finish: NOT SPECIFIED; Terminal Form: WIRE; Terminal Position: BOTTOM; Transistor Element Material: SILICON; Transistor Type: GENERAL PURPOSE SMALL SIGNAL
    368 bytes (45 words) - 01:15, 28 October 2021